EARLY HEARING DETECTION AND INTERVENTION VIRTUAL CONFERENCE
MARCH 2-5, 2021
(Virtually the same conference, without elevators, airplane tickets, or hotel room keys)
5/16/2017 | 11:25 AM - 11:50 AM | Thermal characterization of novel vacuum-insulated vinyl siding | 2
Thermal characterization of novel vacuum-insulated vinyl siding
This article describes the development and thermal characterization of an innovative building insulation system. Vinyl siding is one of the most popular siding types for residential buildings. An insulated vinyl siding prototype has been developed by using vacuum insulation panels (VIP) to significantly improve the thermal performance of insulated vinyl siding. Current insulated siding is limited to overall thermal resistance of about 0.35 m2K/W or lower, which provides little energy-savings benefit. According to the U.S. Department of Energy, in 2010, residential walls attributed to about 3.3 quadrillion BTUs (3.48 x 10^18 Joules) of primary energy consumption. Thus, adding insulation to walls of residential buildings, especially older buildings, represents a huge opportunity.
Here, we describe a novel vacuum-insulated vinyl siding. VIPs can attain very high thermal resistance within small thicknesses; 5-10 times higher resistance than current foam and fibrous building insulation materials at the same thickness. By combining VIPs with vinyl siding, a high-performance insulated siding was created while limiting the thickness to a traditional insulated siding (about 25.4 mm). The prototype vacuum-insulated siding achieved a thermal resistance of 2.05 m2K/W. The thermal characterization of the prototype siding via measurements and simulations is presented.
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Presenters/Authors
Kaushik Biswas
(), Oak Ridge National Laboratory, biswask@ornl.gov;
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Andre Desjarlais
(), Oak Ridge National Laboratory, desjarlaisa@ornl.gov;
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Patrick Olvey
(), Royal Building Products, Patrick.Olvey@royalbuildingproducts.com;
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Chris Johnson
(), Royal Building Products, Chris.Johnson@royalbuildingproducts.com;
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Douglas Smith
(), NanoPore, Inc., smith@nanopore.com;
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